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Power management chip design process platform analysis

Power management chip design process platform analysis

2024-04-08 10:49:24      点击量: 5

Currently, the mainstream process used in the wafer manufacturing process for power management chips is the 0.18um-0.6um BCD process.

Power-management-chip-design-process-platform-analysis.jpg

Due to the different application areas of product performance requirements of different focuses, the process used in the product is slightly different, such as high-voltage products need to choose high-voltage process, digital circuits accounted for a larger proportion of the products need to choose the process of smaller process, AC / DC products according to the needs of the process may be selected 700V ultra-high-voltage process, and so on.

Consumer electronics input voltage requirements for 5V and below, commonly used process for 0.18um-0.35um process range of 5V CMOS process. Wearable devices, TWS headphones and other emerging consumer areas and various types of electronic devices require low power consumption to achieve lower power loss, longer standby time.

Network communication and other input voltage requirements for 12V, 24V, etc., commonly used process for 0.18um-0.35um process range of medium voltage BCD process.

Industrial control, automotive electronics and other input voltage requirements for 24V-100V and above, the common process for the 0.18um-0.6um process range of high-voltage BCD process. Industrial control and other applications on the power management chip requirements lie more in the stability and reliability, while the static power consumption of this indicator is less sensitive.

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